LOAN AGREEMENT
차용증 · Loan Agreement · EN
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LOAN AGREEMENT
Acknowledgment of Debt
LENDER Name: Kim Cheolsu
Address: 45 Mapo-ro, Mapo-gu, Seoul, Korea
BORROWER Name: Lee Chaemu
Address: 67-8 Bundang-dong, Seongnam, Korea
ID/DOB: DOB 1990-01-01
1. Principal
KRW 5,000,000
2. Loan Date and Repayment Due Date
Loan date: September 12, 2026 · Repayment due: March 12, 2027
3. Interest
interest-free
4. Repayment Method
lump-sum repayment at maturity — to account: Kookmin Bank 000-000-000000 (Kim Cheolsu)
The Borrower acknowledges receipt of the Principal and unconditionally undertakes to repay it in full to the Lender by the Repayment Due Date.
September 14, 2026
Borrower: Lee Chaemu ________________
Lender: Kim Cheolsu ________________
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